Direct Bonded Copper (DBC) substrate is a material employed in the fabrication of electronic devices, especially within the power electronics and high end applications sectors. A ceramic based substrate with copper, this one is designed in a way to provide a unique combination of thermal conductivity, mechanical integrity and electrical properties. Mainly, DBC is in use when it comes to high-power modules and devices where effective heat dissipation and high electrical insulation are required.

The Direct Bonded Copper Substrate Market size was USD 306.96 Million in 2023 and is projected to reach USD 867.72 Million by 2032, exhibiting a CAGR of 12.24% during the forecast period 2024-2032.

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